Flexible PCB Manufacturing Capability
Item Typical Advanced
Basic Layer Count 1L – 4L 1L – 8L
Base Material PI(polyimide) PI(polyimide), PET, LCP
Coverlay Color Yellow, Black, White Yellow, Black, White
Min. Brd. Size 10 mm * 20 mm 5 mm * 10 mm
Max. Brd. Size 220 mm * 380 mm 220 mm * 380 mm
Internal Copper Wt. 0.5 oz – 2.0 oz 0.5 oz – 4.0 oz
External Copper Wt. 0.5 oz – 2.0 oz 0.5 oz – 4.0 oz
Min. Single-sided Brd. Thk. 0.10 mm ± 0.05 mm 0.10 mm ± 0.05 mm
Min. Double-sided Brd. Thk. 0.20 mm ± 0.05 mm 0.20 mm ± 0.05 mm
Min. Requirement Min. Drill 0.20 mm 0.15 mm
Min. Conductor Width/Space 0.10 mm / 0.10 mm 0.10 mm / 0.10 mm
Min. Annular Ring 6 mil 4 mil
Min. Coverlay Bridge 0.20 mm 0.20 mm
Min. Copper to Brd. Edge 7 mil 7 mil
Surface Finish RoHS Compliant ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG
Stiffener Material PI, FR-4 PI, FR-4, Metal
PI Stiffener Thk. 0.050 mm – 0.225 mm 0.050 mm – 0.225 mm
FR-4 Stiffener Thk. 0.30 mm – 3.20 mm 0.30 mm – 3.20 mm
Stiffener Registration 0.25 mm 0.25 mm
Tolerance Brd. Thk. Tol. ±0.05 mm(flex), ±0.10 mm(flex + stiffener) ±0.05 mm(flex), ±0.10 mm(flex + stiffener)
Brd. Dimension Tol. ±0.10 mm ±0.05 mm
Impedance Control Tol. ±10% ±10%
Soldernask Registration Tol. 0.125 mm 0.100 mm
Others Impedance Control 50Ω ± 5Ω, 100Ω ± 10% 50Ω ± 5Ω, 100Ω ± 10%
EMI Shielding Coverlay Black Black