Tg-170 FR4 material
6L board with 3 oz copper weight
ENIG for surface finish
2-side SMD assembly
Lead-free soldering workflow
Used for power management
Wireless data receiver board with antenna
2.0 mm thickness of bare PCB
4-layer 35 um of copper thickness
FR4 with Tg value of 170
H.A.L lead-free for surface finish
SMT & THT lead-free assembly
2.4 mm thick backplane
2 oz finished copper weight
FR4 with CTI > 200
Min. 8 / 8 mil trace width / space
Min. average 25 um of hole wall Cu thickness
RoHS compliant soldering
Application of industrial control