Min. board size: 50mm * 50mm
Max. board size: 1,200mm * 370mm
PCB thickness: 0.3mm - 4.0mm
Placement accuracy: ±0.035mm(Cpk≥1)
Placement speed: 42,000CPH
Min. component size: 0201mm
Max. square part size: 74mm * 74mm
Max. rectangular part size: 50mm * 150mm
Max. component height: 25mm
Feeder inputs: max. 112
| Item | Typical | Advanced | |
|---|---|---|---|
| Basic | Layer Count | 1L – 32L | 1L – 32L |
| Base Material & Matching Prepreg | FR-4(standard/medium/high Tg, different CTI, halogen free, CAF resistant) |
FR-4(standard/medium/high Tg, different CTI, halogen free, CAF resistant) |
|
| PTFE | PTFE | ||
| Hydrocarbon/Ceramics | Hydrocarbon/Ceramics | ||
| Finished Brd. Thk. | 0.30 mm – 5.00 mm | 0.20 mm – 7.00 mm | |
| Finished Copper Wt. | 0.5 oz – 4.0 oz(external), 0.25 oz – 4.00 oz(internal) |
0.5 oz – 8.0 oz(external), 0.25 oz – 9.00 oz(internal) |
|
| Min. Brd. Size | 10.00 mm * 20.00 mm (in-board tooling holes) |
8.00 mm * 8.00 mm | |
| Max. Brd. Size | 23″ * 30″(2L), 22″ * 28″(≥4L) | 23″ * 30″(2L), 22.5″ * 30″(≥4L) | |
| Surface Finish | RoHS Compliant | H.A.L. Lead-free, Galvanic Gold, ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG |
H.A.L. Lead-free, Galvanic Gold, ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG |
| Non-RoHS Compliant | H.A.L. Leaded | H.A.L. Leaded | |
| Finish Coating Thk. | Aspect Ratio for H.A.L | ≤5:1(plated hole dia. ≥ 0.30 mm) | ≤5:1(plated hole dia. ≥ 0.30 mm) |
| H.A.L.(leaded & lead-free) | 1 um – 40 um | 1 um – 40 um | |
| OSP | 0.2 um – 0.4 um | 0.2 um – 0.4 um | |
| ENIG | 3 um – 5 um(nickle), 1 uin – 4 uin(gold) |
3 um – 5 um(nickle), 1 uin – 4 uin(gold) |
|
| ENEPIG | ≥ 5 um(nickle), 1 uin – 6 uin(palladium), 1 uin – 6 uin(gold) |
≥ 5 um(nickle), 1 uin – 6 uin(palladium), 1 uin – 6 uin(gold) |
|
| Immerison Silver | 6 uin – 12 uin | 6 uin – 12 uin | |
| Immersion Tin | ≥ 1 um | ≥ 1 um | |
| Galvanic Hard Gold | 5 uin – 40 uin | 5 uin – 80 uin | |
| Gold Finger/Connector | 1 uin – 40 uin | 1 uin – 80 uin | |
| Blue Mask Thk. | 0.20 mm – 0.60 mm | 0.20 mm – 0.60 mm | |
| Carbon Ink Thk. | 10 um – 50 um | 10 um – 50 um | |
| Drill/Hole | Aspect Ratio for Mechanical Drill | 16:1(dia. ≥ 0.30 mm) | 16:1(dia. ≥ 0.30 mm) |
| Min. Mechanical Drill | 0.20 mm | 0.10 mm | |
| Max. Mechanical Drill | 6.30 mm | 6.30 mm | |
| Mechanical Blind Drill | 0.20 mm – 0.50 mm | 0.20 mm – 0.70 mm | |
| Min. Laser Drill | 0.10 mm(single PP1080 thk.) | 0.10 mm(single PP1080 thk.) | |
| Max. Laser Drill | 0.15 mm(single PP3313 thk.) | 0.15 mm(single PP3313 thk.) | |
| Min. Drill for Material PTFE/PTFE Composite | 0.30 mm | 0.30 mm | |
| Min. Half Hole Drill | 0.50 mm | 0.50 mm | |
| Min. Overlapped Drill | 0.45 mm | 0.45 mm | |
| Min. Backdrill | 0.50 mm | 0.50 mm | |
| Min. Dielectric Thk. for Backdrill | 0.20 mm | 0.20 mm | |
| Max. Hole for Bluemask Plugging | 5.00 mm | 5.00 mm | |
| Max. Hole for Soldermask Plugging | 0.65 mm | 0.65 mm | |
| Hole for Epoxy Fill | 0.10 mm – 0.45 mm | 0.10 mm – 0.70 mm | |
| Counter Bore/Sink Hole Angle | 130°(dia.≤3.175 mm), 165°(dia. 3.175 mm – 6.300 mm) |
82°, 90°, 100°, 135°(dia. 3.175 mm – 6.300 mm) |
|
| Min. Mechanical Drill for Different Brd. Thk. | 0.15 mm(brd. thk. ≤ 0.80 mm) | 0.10 mm(brd. thk. ≤ 0.80 mm) | |
| 0.15 mm(brd. thk. ≤ 1.40 mm) | 0.15 mm(brd. thk. ≤ 1.20 mm) | ||
| 0.20 mm(brd. thk. ≤ 2.80 mm) | 0.20 mm(brd. thk. ≤ 2.80 mm) | ||
| Copper Feature | Min. Annular Ring for Mechanical Drill | 4 mil | 4 mil(partially 3.5 mil) |
| Min. Annular Ring for Laser Drill | 4 mil | 4 mil(partially 3.5 mil) | |
| Min. BGA Pad Dia. | 10 mil(excluding H.A.L) | 8 mil(excluding H.A.L) | |
| Min. BGA Pad Dia. for Leaded H.A.L. | 10 mil | 10 mil | |
| Min. BGA Pad Dia. for Lead-free H.A.L. | 12 mil | 12 mil | |
| Min, Pad Size for H.A.L. | 7 mil * 16 mil | 7 mil * 16 mil | |
| Clearance/Distance | Min. External Copper to Brd. Outline Clearance for Not Exposing Copper After Milling |
8 mil | 8 mil |
| Min. Internal Copper to Brd. Outline Clearance for Not Exposing Copper After Milling |
8 mil | 8 mil | |
| Min. Drill to Drill(different nets) Clearance for CAF Proof |
9 mil | 12 mil (≥16 mil for mission critical application) |
|
| Min. Bluemask to Pad Clearance | 14 mil | 14 mil | |
| Min. Drill(compensated) to Conductor Clearance for 1 Buildup |
5.5 mil(4L), 7 mil(6L – 8L), 8 mil(10L – 16L), 9 mil(18L – 28L), 12 mil(>28L) |
5.0 mil(4L), 6 mil(6L – 8L), 7 mil(10L – 16L), 8 mil(18L – 28L), 10 mil(>28L) |
|
| Min. Distance for V-score Jump | 15 mm(brd. thk. ≤ 1.60 mm) | 12 mm(brd. thk. ≤ 1.60 mm) | |
| Solder Mask | Lacquer Color | Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange |
Green(matt/glossy), Yellow, Black(matt/glossy), Blue, Red, White, Orange |
| Min. Soldermask Web | 0.10 mm | 0.075 mm | |
| Min. Soldermask to Pad Clearance | 0.10 mm | 0.10 mm | |
| Min. Soldermask Track Cover | 0.10 mm | 0.10 mm | |
| Soldermask Thk. on Copper | 10 um – 18 um | 10 um – 18 um | |
| Soldermask Thk. at Shoulder | ≥ 5 um(one-time printing) | ≥ 5 um(one-time printing) | |
| Soldermask Thk. over Hole | ≥ 5 um | ≥ 5 um | |
| Legend | Lacquer Color | White, Yellow, Black, Orange | White, Yellow, Black, Orange |
| Min. Stroke Width | 0.17 mm | 0.17 mm | |
| Min. Height for Legibility | 1.00 mm | 1.00 mm | |
| Min. Legend to Pad Clearance | 4 mil | 4 mil | |
| Markings | Method | Etched, Soldermasked, Silkscreened/Printed |
Etched, Soldermasked, Silkscreened/Printed |
| Type | Text, Number, Graphics, Bar code, QR code |
Text, Number, Graphics, Bar code, QR code |
|
| Profile | Panelization | V-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & Perforation |
V-score, Tab-routing, Tab-routing & Perforation, Tab-routing & V-score, Tab-routing & V-score & Perforation |
| V-score Angle | 20°, 30°, 60° | 20°, 30°, 60° | |
| Brd. Thk. for Double-side V-score | 0.80 mm – 3.20 mm | 0.80 mm – 3.20 mm | |
| Brd. Thk. for Single-side V-score | 0.60 mm – 0.80 mm | 0.60 mm – 0.80 mm | |
| Min. Inside Corner Radius | 0.40 mm | 0.30 mm | |
| Finger/Edge Connector | Edge Beveling Angle | 30°, 45° | 30°, 45° |
| Edge Chamfering Corner | 45° | 45° | |
| Min. Notch Width beside Edge Connector | 0.20 mm | 0.20 mm | |
| Edge Beveling Depth | 0.50 mm | 0.50 mm | |
| Min. Finger Top to Copper Distance | 3.00 mm | 2.00 mm | |
| Min. Finger Bot. to Brd. Outline | 7.00 mm | 6.00 mm | |
| Min. Finger to Finger Clearance | 6 mil | 5 mil | |
| Others | Brd. Thk. for Epoxy Fill | 0.50 mm – 6.50 mm | 0.40 mm – 6.50 mm |
| Min. Channel for Internal Split Plane | 8 mil | 8 mil | |
| Min. Trace Width/Space for Epoxy Fill | 4.0 mil / 4.0 mil | 3.5 mil / 3.5 mil | |
| Item | Standard | Advanced | |
|---|---|---|---|
| Drill/Hole | Hole Position Tol. | ±3 mil | ±3 mil |
| PTH Dia. Tol. | ±3 mil | ±3 mil | |
| NPTH Dia. Tol. | ±2 mil | ±2 mil, +2 mil – 0 mil, 0 mil – (-2) mil |
|
| Pressfit Hole Dia. Tol. | ±2 mil | ±2 mil | |
| Drilled Slot Hole Tol. | ±0.05(L)/0.05(W) mm(unplated), ±0.13(L)/0.10(W) mm(plated) |
±0.05(L)/0.05(W) mm(unplated), ±0.13(L)/0.10(W) mm(plated) |
|
| Milled Slot Hole Tol. | ±0.10(L)/0.10(W) mm(unplated), ±0.13(L)/0.13(W) mm(plated) |
±0.10(L)/0.10(W) mm(unplated), ±0.13(L)/0.13(W) mm(plated) |
|
| Backdrill Depth Tol. | ±4 mil | ±4 mil | |
| Counter Bore/Sink Hole Angle Tol. | ±10° | ±10° | |
| Counter Bore/Sink Hole Dia. Tol. | ±0.20 mm | ±0.20 mm | |
| Counter Bore/Sink Hole Depth Tol. | ±0.15 mm | ±0.15 mm | |
| Profile | Brd. Dimension Tol. | ±0.10 mm | ±0.10 mm |
| Inside Cutout Position Tol. | ±0.10 mm | ±0.10 mm | |
| V-score Angle Tol. | ±5° | ±5° | |
| V-score Web Thk. Tol. | ±0.05 mm | ±0.05 mm | |
| V-scores Offset Tol. | ±0.10 mm | ±0.10 mm | |
| Finger/Edge Connector | Edge Beveling Angle Tol. | ±5° | ±5° |
| Edge Beveling Remaining Thk. Tol. | ±5 mil | ±5 mil | |
| Others | Brd. Thk. Tol. | ±0.10 mm(thk.≤1.00 mm), ±10%(thk.>1.00 mm) |
±0.10 mm(thk.≤2.00 mm), ±0.15(2.10≤thk.≤3.00 mm) |
| Brd. Warp & Twist | 0.75% | 0.50% | |
| Impedance Control Tol. | ±5Ω(<50Ω), ±10%(≥50Ω) | ±5Ω(<50Ω), ±8%(≥50Ω) | |
| Trace Width/Space Tol. | ±1.0 mil(≤10 mil), ±1.5 mil(>10 mil) |
±1.0 mil(≤10 mil), ±1.5 mil(>10 mil) |
|
| Layer to Layer Registration Tol. | ≤2 mil | ≤2 mil | |
| Item | Typical | Advanced | |
|---|---|---|---|
| Basic | Layer Count | 1L – 4L | 1L – 8L |
| Base Material | PI(polyimide) | PI(polyimide), PET, LCP | |
| Coverlay Color | Yellow, Black, White | Yellow, Black, White | |
| Min. Brd. Size | 10 mm * 20 mm | 5 mm * 10 mm | |
| Max. Brd. Size | 220 mm * 380 mm | 220 mm * 380 mm | |
| Internal Copper Wt. | 0.5 oz – 2.0 oz | 0.5 oz – 4.0 oz | |
| External Copper Wt. | 0.5 oz – 2.0 oz | 0.5 oz – 4.0 oz | |
| Min. Single-sided Brd. Thk. | 0.10 mm ± 0.05 mm | 0.10 mm ± 0.05 mm | |
| Min. Double-sided Brd. Thk. | 0.20 mm ± 0.05 mm | 0.20 mm ± 0.05 mm | |
| Min. Requirement | Min. Drill | 0.20 mm | 0.15 mm |
| Min. Conductor Width/Space | 0.10 mm / 0.10 mm | 0.10 mm / 0.10 mm | |
| Min. Annular Ring | 6 mil | 4 mil | |
| Min. Coverlay Bridge | 0.20 mm | 0.20 mm | |
| Min. Copper to Brd. Edge | 7 mil | 7 mil | |
| Surface Finish | RoHS Compliant | ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG | ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG |
| Stiffener | Material | PI, FR-4 | PI, FR-4, Metal |
| PI Stiffener Thk. | 0.050 mm – 0.225 mm | 0.050 mm – 0.225 mm | |
| FR-4 Stiffener Thk. | 0.30 mm – 3.20 mm | 0.30 mm – 3.20 mm | |
| Stiffener Registration | 0.25 mm | 0.25 mm | |
| Tolerance | Brd. Thk. Tol. | ±0.05 mm(flex), ±0.10 mm(flex + stiffener) | ±0.05 mm(flex), ±0.10 mm(flex + stiffener) |
| Brd. Dimension Tol. | ±0.10 mm | ±0.05 mm | |
| Impedance Control Tol. | ±10% | ±10% | |
| Soldernask Registration Tol. | 0.125 mm | 0.100 mm | |
| Others | Impedance Control | 50Ω ± 5Ω, 100Ω ± 10% | 50Ω ± 5Ω, 100Ω ± 10% |
| EMI Shielding Coverlay | Black | Black | |